Heat Dissipation Optimization of Molybdenum-Copper Alloy
Due to its high thermal conductivity, low thermal expansion coefficient and excellent high-temperature stability, molybdenum-copper…
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What Are the Applications of Molybdenum-Copper Alloy in Aerospace Electronic Packaging?
Aerospace electronic equipment needs to operate in extreme environments, such as high temperatures, severe temperature…
The Role of Molybdenum-Copper Alloys in High-Power Laser Packaging
High-power lasers have a wide range of applications in industrial processing, medical devices, military applications,…
The Heat Dissipation Effect of Mo-Cu Alloy in the Rf Module of 5G Base Stations
With the rapid development of 5G communication technology, the number of base stations and power…
The Key Role of Molybdenum-Copper Alloys in MOSFET Packaging
Metal-oxide-semiconductor field-effect transistors (MOSFETs) are widely used in power electronics, communication equipment, automotive electronics, and…
The Key Role of Mo-Cu Alloys in IGBT Packaging
Insulated gate bipolar transistor (IGBT) is a semiconductor device widely used in power electronic systems,…
Applications of Mo-Cu Alloy in High-Power Semiconductor Packaging
High-power semiconductor devices play a vital role in modern power electronics systems, and are widely…
Effect of Different Molybdenum-Copper Ratios on the Performance of Electronic Packaging
The specific properties of molybdenum-copper alloys are greatly affected by their composition ratios, and different…
Effect of Liquid-Phase Sintering on the Properties of Molybdenum-Copper Alloys
The liquid phase sintering (LPS) process is widely used in the preparation of molybdenum-copper alloys…
Liquid-Phase Sintering Process of Molybdenum-Copper Alloys
Liquid phase sintering (LPS) is a sintering method in which some substances enter the liquid…