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Due to its high thermal conductivity, low thermal expansion coefficient and excellent high-temperature stability, molybdenum-copper alloy has a wide application prospect in the field of heat dissipation of high-power electronic devices. The heat dissipation performance of Mo-Cu alloys can be further improved by optimizing the Mo-Cu ratio, increasing the density of the material, adopting a gradient structure, optimizing the interface material, and developing new composite materials. Molybdenum-copper alloy heat dissipation optimization strategy 1. Adjust the Mo-Cu ratio to improve the…

Aerospace electronic equipment needs to operate in extreme environments, such as high temperatures, severe temperature changes, high vacuum, strong radiation and vibration shocks. As a result, high requirements are placed on electronic packaging materials, including high thermal conductivity, low coefficient of thermal expansion (CTE), high temperature resistance, and mechanical stability. Molybdenum-copper (Mo-Cu) alloy is a composite material with both high thermal conductivity and low thermal expansion characteristics, which shows excellent application value in the field of aerospace electronic packaging. Aerospace…

High-power lasers have a wide range of applications in industrial processing, medical devices, military applications, and optical communications. However, these lasers generate a lot of heat during operation, which can lead to laser degradation, beam drift, and even device failure if heat dissipation is not dissipated in a timely manner. Therefore, thermal management is a core issue in the design of high-power laser packages. Molybdenum-copper (Mo-Cu) alloys, as high-performance heat sink materials, play a key role in laser packaging due…

With the rapid development of 5G communication technology, the number of base stations and power density have increased significantly, especially in the high-frequency millimeter wave band, and the power loss of radio frequency (RF) modules has increased significantly. Because RF power amplifier chips generate a lot of heat during operation, if the heat is not dissipated properly, it may lead to degraded device performance, signal distortion, and even shortened equipment life. Therefore, how to effectively manage heat has become a…

Metal-oxide-semiconductor field-effect transistors (MOSFETs) are widely used in power electronics, communication equipment, automotive electronics, and industrial control due to their high-speed switching, low on-resistance, and high-efficiency energy conversion. However, MOSFETs generate a lot of heat in high-power applications, which can affect their performance and lifetime if heat dissipation is not dissipated in a timely manner. Therefore, the choice of encapsulation material is crucial. In MOSFET packaging, molybdenum-copper (Mo-Cu) alloy has become one of the key packaging materials due to its…

Insulated gate bipolar transistor (IGBT) is a semiconductor device widely used in power electronic systems, which plays an important role in industrial automation, new energy vehicles, rail transit, and smart grid due to its high efficiency, fast switching characteristics, and high withstand voltage capability. However, IGBTs generate a lot of heat during operation, so efficient heat dissipation and stable mechanical structure are essential for their reliability. Molybdenum-copper (Mo-Cu) alloys play a vital role in IGBT packaging. Its high thermal conductivity,…

High-power semiconductor devices play a vital role in modern power electronics systems, and are widely used in new energy vehicles, power transmission, industrial control, aerospace and communication equipment. However, in high-power operating environments, these semiconductor devices generate a significant amount of heat, which can lead to degraded performance, reduced reliability, and even device failure if not dissipated effectively. Therefore, the selection of packaging materials is particularly critical to combine high thermal conductivity, low coefficient of thermal expansion (CTE) and excellent…

The specific properties of molybdenum-copper alloys are greatly affected by their composition ratios, and different molybdenum-copper ratios will directly affect their thermal, mechanical and electrical properties, thereby affecting the performance of electronic packaging. Effect on thermal properties In electronic packaging, heat dissipation performance is crucial, especially in high-power electronic devices, where the thermal conductivity of the packaging material directly determines the stability and lifetime of the device. The thermal conductivity of molybdenum-copper alloys increases with the increase of copper content,…

The liquid phase sintering (LPS) process is widely used in the preparation of molybdenum-copper alloys due to its excellent densification ability, high thermal conductivity and optimized mechanical properties. By properly controlling the sintering temperature, atmosphere, powder particle size and alloy composition, the final properties of Mo-Cu alloys can be significantly improved to meet the demanding requirements of high-end electronic packaging and aerospace applications. 1. Key influencing factors of liquid-phase sintering 1.1 Molybdenum-copper ratio An increase in molybdenum content will reduce…

Liquid phase sintering (LPS) is a sintering method in which some substances enter the liquid phase during the sintering process and promote the densification of particles. For molybdenum-copper alloys, since the melting point of molybdenum is as high as 2617 °C, while the melting point of copper is only 1083 °C, when the sintering temperature exceeds the melting point of copper but is much lower than the melting point of molybdenum, the copper will partially melt and fill the pores…